DUBLIN–(BUSINESS WIRE)–The “High Density Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering.
The high-density packaging market is estimated to register a cagr of 12% over the forecast period of 2021 – 2026. The growing advancement in consumer electronic products will drive the market in the forecast period.
Companies Mentioned
- Toshiba Corporation
- IBM Corporation
- Amkor Technology
- Fujitsu Ltd.
- Siliconware Precision Industries
- Hitachi, Ltd.
- Samsung Group
- Micron Technology
- STMicroelectronics
- NXP Semiconductors N.V.
- Mentor – a Siemens Business
Key Market Trends
High Application in Consumer Electronics Segment to Augment the Market Growth
- The electronics market constantly demands higher power dissipation, faster speeds, and higher pin counts, along with smaller footprints and lower profiles. The miniaturization and integration of high density semiconductor packaing have given rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices.
- According to the Semiconductor Industry Association, the global sales of the semiconductor have increased by 13.7% with USD 468 billion in 2018. The industries have reported the highest sales revenue and shipment 1 trillion units.
- However, according to world semiconductor trade statistics, the demand has decreased in 2019 due to the weaker pricings of ICs, there will still be an increase in demand from 2020 due to consumer electronic products. For instance, the United States has witnessed consistent growth in smartphone sales. With this trend likely to continue, it is poised to drive the high density packaging market in the forecast period into other regions as well.
Asia-Pacific to Witness the Highest Growth in High Density Packaging Market
- Asia-Pacific is expected to grow at a healthy rate, being a major revenue-generating region during the forecast period, primarily owing to the growing population and the customer-side demand. Prominent high density packaging companies present in the region are fueling the demand for high density packaging in the market.
- Moreover, China is the largest growing economy with a large population, and according to statistics from China’s semiconductor association, the import of IC is increasing for the consecutive year from 2014.
- Furthermore, the Chinese government has employed a multi-pronged strategy to support domestic IC industry development in order to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the high density packaging demand.
Key Topics Covered:
1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Growing Advancements in Consumer Electronic Products
4.3.2 Favourable Government Policies and Regulations in Developing Countries
4.4 Market Restraints
4.4.1 High Initial Investment and Increasing Complexity of IC Designs
4.5 Value Chain / Supply Chain Analysis
4.6 Industry Attractiveness – Porter’s Five Force Analysis
5 MARKET SEGMENTATION
5.1 By Packaging Technique
5.1.1 MCM
5.1.2 MCP
5.1.3 SIP
5.1.4 3D – TSV
5.2 By Application
5.2.1 Consumer Electronics
5.2.2 Aerospace & Defence
5.2.3 Medical Devices
5.2.4 IT & Telecom
5.2.5 Automotive
5.2.6 Other Applications
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East and Africa
6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Toshiba Corporation
6.1.2 IBM Corporation
6.1.3 Amkor Technology
6.1.4 Fujitsu Ltd.
6.1.5 Siliconware Precision Industries
6.1.6 Hitachi, Ltd.
6.1.7 Samsung Group
6.1.8 Micron Technology
6.1.9 STMicroelectronics
6.1.10 NXP Semiconductors N.V.
6.1.11 Mentor – a Siemens Business
7 INVESTMENT ANALYSIS
8 MARKET OPPORTUNITIES AND FUTURE TRENDS
For more information about this report visit https://www.researchandmarkets.com/r/19k4d5
